Zhejiang Lingchao Electronic Technology Co., Ltd. Expands Production with Advanced FPC and Rigid-Flex Circuit Board Series

Since its founding in 1998, the company has grown from a small workshop into a leading enterprise with a 30‑acre factory complex and over 300 employees. The new FPC Flexible Board Series and soft‑hard combination board series are produced using state‑of‑the‑art equipment, including automatic optical hole inspection machines, AOI optical scanners, precision imaging measurement systems, metallographic microscopes, automatic testers, four‑wire flying probe testers, two‑wire flying probe testers, CNC drilling and milling machines, laser direct imaging (LDI) exposure units, VCP automatic electroplating lines, dry film automatic laminators, and DES (develop‑etch‑strip) lines. This advanced infrastructure ensures exceptional precision and consistency in every batch.

The FPC Flexible Board Series offers outstanding flexibility, bendability, and dynamic performance, making them ideal for applications such as foldable smartphones, wearable health monitors, and automotive sensor systems. Meanwhile, the soft‑hard combination boards combine the best of both rigid and flexible substrates, enabling three‑dimensional packaging and reducing the need for connectors and cables. These products are available with various surface finishes, including the high‑quality OSP Antioxidant Board, which provides superior oxidation protection and is compatible with lead‑free soldering processes. Other finish options include nickel gold plating, spray tin plating, immersion silver, and immersion gold, each tailored to specific assembly and environmental requirements.

In addition to flexible and rigid‑flex solutions, Lingchao continues to excel in traditional rigid circuit boards. The company offers FR‑4 multilayer circuit boards, as well as FR‑4 and CEM‑3 double‑sided circuit boards, which are widely used in communication base stations, industrial controllers, power supplies, and consumer electronics. The Single sided electronic circuit board remains a cost‑effective choice for simpler applications, while the Double sided electronic circuit board provides increased routing density for more complex designs. For high‑performance computing and telecom equipment, the multi‑layer electronic circuit board delivers excellent signal integrity and thermal management.

Quality assurance is a cornerstone of Lingchao’s operations. The company holds IATF16949 and ISO9001 certifications for quality management, ISO14001 for environmental management, as well as CQC and UL product certifications. These accreditations reflect the company’s unwavering commitment to producing reliable and safe printed circuit boards. Every product undergoes rigorous incoming material inspection, in‑process monitoring, and final electrical testing using automated testing machines and flying probe testers. The metallographic microscope and precision imaging systems enable detailed analysis of micro‑sections to verify plating thickness, via integrity, and solderability.

The company’s engineering team has developed numerous lead‑free processes, including spray tin, electroless nickel gold, immersion tin, immersion silver, and OSP treatments. These environmentally friendly finishes meet the requirements of RoHS and WEEE directives, ensuring global compliance. Lingchao’s dedication to innovation is further demonstrated by its investment in laser direct imaging technology, which allows for fine‑line patterning and rapid prototyping, reducing turnaround times for new designs.

With a sales network covering domestic China and exports to Europe, North America, and Asia‑Pacific, Lingchao has built a reputation for on‑time delivery and responsive customer service. The company’s strategic location in Wenzhou’s Binhai New Area provides easy access to major ports and highways, facilitating efficient logistics. Whether for high‑volume production or small‑batch prototypes, Lingchao offers flexible manufacturing options to suit diverse order sizes.

Looking forward, Lingchao plans to continue expanding its technological capabilities, focusing on higher layer counts, finer trace widths, and advanced materials for 5G, automotive electrification, and Internet of Things (IoT) applications. The introduction of FPC and soft‑hard combination boards marks a significant milestone, positioning the company as a comprehensive solutions provider for all types of electronic interconnects. Customers can rely on Lingchao’s integrated services, from design support and material selection to production and testing, all under one roof.

For more information about our products, including the OSP antioxidant board series, Nickel Gold Plate Series, Spray Tin Plate Series, or any of our circuit board offerings, please reach out to our team. Contact Mr. Xu at mr.xu@lingchaopcb.com or call +86 13780181891 for expert assistance and competitive quotations. We look forward to partnering with you on your next project.