Boz FR4 PCB with OSP Coating Antioxidation Process

Product Introduction

1. Structure & Process Features

• Base Material & Coating: Made of Boz FR4 material, paired with OSP coating antioxidation process—this treatment enhances the corrosion resistance of the electronic board’s copper circuit, extending its storage and service life.
• Structural Design: As a single sided electronic circuit board, it features a one-sided copper circuit layout, with standard via holes and pad positions for component soldering, matching basic electronic device assembly needs.

2. Application Scenarios

• Industry Adaptability: Used as a core circuit board in low-complexity electronic devices (e.g., small household appliances, simple control modules), responsible for signal and power transmission in electronic systems.

3. Advantages

• Cost-Effective Performance: The single sided electronic circuit board structure balances functionality and cost, suitable for mass-produced low-power electronic products.
• Process Reliability: The OSP coating antioxidation process ensures the stability of the copper circuit, complying with electronic board quality standards, and is applicable to global basic electronic manufacturing markets.